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K5-PRO 60gr visqueux pâte thermique pour remplacement pad thermique PS3,PS4,XBOX

K5-PRO 60gr visqueux pâte thermique pour remplacement pad thermique PS3,PS4,XBOX

4.8 (340) · € 24.99 · En Stock

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K5-PRO 60gr visqueux pâte thermique pour remplacement pad thermique PS3,PS4, XBOX

Thermal Paste & pad Replacement Set K5 PRO Compatible with iPhone, iMac PS4 PS3 Xbox Asus Dell etc, CSGR : Electronics

Viscous thermal paste for thermal pad replacement K5 PRO 60g 6X10g iMac PS4 PS3

K5 PRO 30g (3X10g) Viscous Thermal Paste for Thermal Pad Replacement Liquid Thermal Pad : Electronics

K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and other components where thermal pads are originally used. K5-PRO can replace soft thermal pads that are used on computers (best performance up to 1mm, maximum gap that can be filled up to 3mm). K5-PRO has thermal conductivity K 5,3 W/m.K * (at least 3 times higher than common thermal pads that are used on computers and commercial electronics).

COMPUTERSYSTEMS Repair Services Data Recovery K5 Pro K5-PRO 110g Thermal Paste for Thermal Pad Replacement

Liquid thermal paste K5 pro for iMac Xbox PS Asus ROG MSI - AliExpress

Laptop MB Repair Service. Data Recovery Services. Laptop Parts. Add to Favorites. New Arrival. Quick Links. We are happy to assist you! You have two

K5-PRO 30gr Viscous Heat Paste for Replacement Heat Pad PS4, iMac

Laptop MB Repair Service. Data Recovery Services. Laptop Parts. Add to Favorites. New Arrival. Quick Links. We are happy to assist you! You have two

K5-PRO 60gr Viscous Heat Paste for Replacement Heat Pad PS3,PS4,XBOX

Laptop MB Repair Service. Data Recovery Services. Laptop Parts. Add to Favorites. New Arrival. Quick Links. We are happy to assist you! You have two

K5-PRO 30gr Viscous Heat Paste for Replacement Heat Pad PS4, iMac

K5 PRO Viscous Thermal Paste for Thermal pad Replacement 20g (Apple iMac, Sony PS4 & PS3, Xbox, Acer Aspire etc) : Electronics

K5-PRO viscous thermal paste is developed and produced by Computer Systems laboratories research department. This product was developed as part of C.S. Labs BGA rework research project with the support of Greece and Europian Union. This product is designed to reduce the chances of BGA component failure for reasons related to overheating.